• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    24 BE 2014/0457 Excerpt Rigid ESD packaging for electronic components A system for transporting and / or storing an electronic component. The system is a gas-tight container that includes a rigid electrostatically sensitive device protecting bottom plate and an electrostatically sensitive device protecting cover. The bottom plate (101) includes a volume (105) for receiving an electronic component and a component holder (104) for securing the electronic component. The gas-tight electrostatically sensitive device protective cover (201) is connectable to the bottom plate in such a way as to maintain vacuum or an inert gas in the container when the container is closed, the bottom plate and / or the cover being wholly or partially transparent. . 15 + FIG. 1 2014/0457
    公开号:BE1022155B1
    申请号:E2014/0457
    申请日:2014-06-17
    公开日:2016-02-19
    发明作者:Bertrand LETERME；Philip NIVILLE
    申请人:Melexis Technologies Nv；
    IPC主号:
    专利说明:

    Rigid ESD package for electronic components. Field of the invention
    The invention relates to the field of storing and / or transporting electronic components. More specifically, it relates to a system for storing and / or transporting electronic components without damaging or contaminating the electronic components either by electrostatic discharge, moisture or physical damage.
    BACKGROUND OF THE INVENTION
    Electronic components (e.g. integrated circuits) are known to be sensitive to electrostatic discharge (ESD), they are also sensitive to the accumulation of moisture in the device, especially when soldering is required afterwards, and they are susceptible to physical damage.
    With regard to ESD, electronic components are sensitive to the accumulation of loads in their packaging. This charge accumulation, when discharged by grounding the device, can result in serious damage to the device. That is why attention must be paid to ESD during the entire life cycle of the establishment. An important aspect is the packaging for storage and transport.
    With regard to moisture, electronic components are sensitive to the accumulation of moisture in the device. When moisture is present in the device, the device may crack if heated during soldering. It is therefore important to heat moisture sensitive devices before packaging them. When they are packaged, it is important that they are packaged dry. Often this is done by vacuum-sealing a bag after the device and possibly also a drying agent have been placed in the bag. A disadvantage is that the desiccant will only work efficiently in its immediate environment. In addition, since the vacuum is sealed, the bag itself can form an obstacle for the drying agent to work efficiently by closing the device.
    With regard to physical damage, it is important that the electronic components are not physically damaged during transport and storage. Physical damage could cause malfunction of the components and / or prevent the components from being soldered. In cases where rolls (English: "reel") and bands (English: "tapes") are transported and stored, damage to the roll or band can also lead to incorrect operation of the soldering process afterwards.
    For packaging electronic components, rolls or slices (English: "wafers"), moisture barrier bags are often used (English: "moisture barrier bags", abbreviated MBB). Such bags have been developed for the dry packaging of electronic components and for protecting the components against moisture and electrostatic damage. The bags can be vacuum sealed after packaging. These bags can for example be made from different layers of different materials such as polyester, aluminum and polyethylene.
    However, these bags have the following disadvantages: - protection against physical damage is not sufficient, - visual inspection before unpacking is impossible, - since additional means of storage are needed to prevent damage to the bag, this can be a soft layer between two bags (eg a cardboard sheet of 3 mm), it is not easy to store them, - they are prone to puncture damage which could lead to leakage on the end user's side and result in moisture damage, - they require manual vacuum seal, - they have a maximum shelf life of 12 months, which will deteriorate if the seal is incorrect due to the manual process or bag damage.
    Summary of the invention
    It is an object of embodiments of the present invention to provide reliable systems for packaging electronic components.
    It is an advantage of embodiments of the present invention that a container for packaging the electronic components is made of an ESD protective material that protects the electronic components it contains from building up an electrical charge that could lead to serious damage if she is discharged.
    It is an advantage of embodiments of the present invention that the container for packaging the electronic components protects the electronic components it contains from physical damage.
    It is an advantage of embodiments of the present invention that the bottom plate of the container for packaging the electronic components is not susceptible to puncture damage and therefore leakage due to puncture damage can be prevented. Preventing leakage is an advantage since moisture is kept out of the holder, which increases the shelf life of the electronic components. In certain embodiments of the present invention, a storage time of more than 2 years can be guaranteed. It is an advantage of embodiments of the present invention that the container for packaging the electronic components is wholly or partially transparent, which allows visual inspection of the contents of the container. In certain embodiments of the present invention, labels that may be present on the electronic components as well as optional moisture indicators may be visible from the outside of the container through the transparent parts of the container.
    It is an advantage of embodiments of the present invention that the container for packaging the electronic components can be vacuum sealed or filled with an inert gas to protect the electronic components from moisture absorption.
    It is an advantage of embodiments of the present invention that the cover can be easily gas-tightly connected to and / or easily removed from the holder.
    It is an advantage of embodiments of the present invention that good labeling can be obtained. In comparison with other packaging means such as, for example, a bag, embodiments of the present invention can provide a flat surface that allows easy labeling. Moreover, it is advantageous that, due to the flat surface, the label can be easily read or scanned.
    It is an advantage of embodiments of the present invention that allows automation of the packaging procedure. It is an advantage of embodiments of the present invention that the rigid bottom plate permits simple handling by packaging tools. It is an advantage of embodiments of the present invention that it requires no additional means for storing, except for the containers themselves.
    It is an advantage of embodiments of the present invention that it provides a longer shelf life of the electronic components it contains.
    In a first aspect, the present invention relates to a gas-tight container, which preferably has a moisture vapor permeability of less than 0.01 g / m2 / day, for transporting and / or storing electronic components, the container comprising: - a gas-tight rigid electrostatically sensitive device protective bottom plate comprising a volume for receiving said electronic component, - a gas-tight electrostatic sensitive device protective cover which can be connected in a gas-tight manner to the bottom plate, the bottom plate and / or the cover being wholly or partly transparent . Having a fully or partially transparent bottom plate and / or lid is advantageous since it allows visual inspection of the contents of the container.
    The container according to the present invention comprises a gas-tight electrostatically sensitive device protective lid. This lid, for example, fits on the bottom plate and can be sealed on the bottom plate. The lid can be, for example, a simple electrostatically sensitive device protective film or a lid made of a hard plastic. Depending on the type of material used for the lid, different types of sealing can be used. In embodiments of the present invention, glue seal, mechanical seal, heat seal, ultrasonic seal, or combinations thereof can be used.
    In one embodiment, the bottom plate may comprise at least one compartment for containing drying agents and wherein a direct opening is present between said volume and said compartment. This is advantageous since it guarantees that the drying agent is not sealed off from the electronic component. This allows the drying agent to work efficiently.
    In one embodiment, said at least one compartment can be a plurality of compartments. The plurality of compartments can, for example, be symmetrically distributed around the said volume for receiving an electronic component.
    This is advantageous since it allows for an even moisture absorption of anywhere within the container volume. In embodiments, the compartments for containing the desiccants may be provided around and close to the electronic component. In embodiments, the desiccant holding compartment may be provided within the volume for receiving said electronic component. In other embodiments, the desiccant-containing compartment is located outside the volume for receiving said electronic component, and is only in fluid communication with said volume through a direct opening connecting the compartment to the volume. This direct opening may have a smaller cross-section than the cross-section of the compartment as well as smaller than the cross-section of the volume to prevent the contents of the compartment from penetrating into the volume provided for receiving the electronic component and vice versa.
    In one embodiment, said bottom plate may comprise a component holder for attaching said electronic component to said bottom plate. It is an advantage of embodiments of the present invention that the container for packaging the electronic components has a component container for attaching the electronic components to the container and thereby protects the components from physical damage. The component holder is preferably ESD protective, but need not be ESD protective.
    In one embodiment, the bottom plate may comprise at least one compartment for a humidity indicator. In embodiments, the compartment for containing a humidity indicator may be provided within the volume for receiving said electronic component. In other embodiments, the humidity indicator compartment is located outside the volume for receiving said electronic component, and is only in fluid communication with said volume through a direct opening connecting the compartment to the volume. This direct opening may have a cross-section smaller than the cross-section of the compartment, and smaller than the cross-section of the volume, to prevent the contents of the compartment from penetrating into the volume for receiving the electronic component, and vice-versa versa.
    In one embodiment, the lid can be at least partially transparent, and the humidity indicator compartment can be placed under a transparent portion of the lid when the lid and bottom plate are connected to each other in a gas-tight manner. Such positioning is advantageous since it allows visual inspection of the humidity indicator without opening the package.
    In one embodiment, the bottom plate can be made of a rigid, possibly transparent, electrostatically sensitive device protective plastic.
    The bottom plate can for instance be made of a hard ESD plastic, the type of plastic used depending on the requirements set by the electronic components. In one embodiment, the cover can be made of a rigid, possibly transparent, electrostatically sensitive device protective plastic. This has the advantage of being mechanically protective, but the inconvenience of being more difficult to seal and open. In one embodiment the bottom plate can be made of an ESD plastic. The ESD plastic can have a flat resistance between 103 Ω / square and 1012 Ω / square, preferably between 105 to 10n Ω / square. The ESD plastic can have an electrostatic decay time of less than 2 seconds. In certain embodiments of the present invention, the lid is made of a rigid ESD plastic.
    In one embodiment, the cover can be made of an at least partially transparent electrostatically sensitive device protective film or film. The film or film is generally flexible.
    In one embodiment of the present invention, the material used for the lid and / or bottom plate can meet the JEDEC standard (IPC / JEDEC J-STD-033B.1). The film used or the film used can be composed of several layers, each with different functionalities. A distinction can be made between layers for obtaining a low electrical surface resistance, layers that serve as a moisture barrier, and layers for increasing the strength of the film against puncture or tensile forces. The web can for example be a multilayer structure comprising thermoplastic and metallic layers. An example of such a structure is a multi-layer structure that comprises polyester, aluminum and polyethylene layers. The protective film seals with the base plate in a gas-tight manner.
    In one embodiment, the ESD film can have a planar resistance between ΙΟ3 Ω / square and 1012 Ω / square, preferably between 105 and 1011 Ω / square.
    In one embodiment, the container may have a gas density expressed as a moisture permeability rate (MVTR) of less than 0.01 g / m2 / day.
    In one embodiment, the bottom plate and the lid can be connectable in such a way that, when the container is closed, it has a low moisture permeability rate (MVTR below 0.01 g / m2 / day). For this reason, the bottom plate, the lid and optionally present sealants all have a low MVTR, preferably below 0.01 g / m2 / day.
    In one embodiment, the holder has a puncture resistance higher than 17 lbs (about 7.7 kg), preferably higher than 20 lbs (about 9.1 kg), most preferably higher than 30 lbs (about 13.6 kg) ), as measured according to the FTMS 101 MTH 2065 standard.
    In one embodiment, the shape of the holder can be adapted to stack one holder on top of another holder in such a way that lateral movement of one holder relative to the other holder is prevented. This is advantageous because it prevents movement of one holder relative to the other, thereby reducing the risk of shocks. Additional means for storing (such as boxes such as those commonly used for storing bags from the prior art) are therefore not required. It is easy to stack several containers on top of each other or to store the containers in any other way, such as eg hanging the containers on a rail, stacking them against each other or storing them in an automated storage room / space, without requiring additional resources for saving.
    In a second aspect, the present invention relates to a gas-tight rigid electrostatically sensitive, device-protecting bottom plate for a holder according to the first aspect, wherein the bottom plate comprises a volume for receiving said electronic component, the bottom plate being wholly or partly transparent .
    All embodiments of the first aspect that characterize the bottom plate are also embodiments of the second aspect of the present invention. ; In a third aspect the present invention relates to the use of a holder according to the first aspect or the use of a bottom plate according to the second aspect for transporting and / or storing an electronic component.
    Specific and preferred aspects of the invention are included in the attached independent and dependent claims. Features of the dependent claims can be combined with features of the independent claims and with features of other dependent claims as appropriate and not merely as explicitly stated in the claims.
    These and other aspects of the invention will be apparent from and clarified with reference to the embodiment (s) described below.
    BRIEF DESCRIPTION OF THE FIGURES FIG. 1 shows a schematic drawing of the base plate of a holder for containing electronic components according to an embodiment of the present invention. The top view of the bottom plate is shown. FIG. 2 shows a schematic drawing of a side view of a holder for containing electronic components according to an embodiment of the present invention. The side view of both the bottom plate and the side view of the lid are shown. FIG. 3 shows an embodiment of a bottom plate according to an embodiment of the present invention. The top view is shown. FIG. 4 shows a side view of the bottom plate of FIG. 3. FIG. 5 shows a 3D view of the embodiment of FIG. 3.
    The figures are only schematic and non-limiting. In the figures, the dimensions of some parts may be exaggerated and not represented to scale for illustrative purposes.
    Reference numbers in the claims may not be interpreted to limit the scope of protection.
    In the different figures, the same reference numbers refer to the same or similar elements.
    Detailed description of embodiments of the invention
    The present invention will be described with reference to particular embodiments and with reference to certain drawings, however, the invention is not limited thereto but is only limited by the claims. The figures are only schematic and non-limiting. In the figures, the dimensions of some parts may be exaggerated and not represented to scale for illustrative purposes. The dimensions and the relative dimensions sometimes do not correspond to the current practical embodiment of the invention.
    Furthermore, the terms first, second and the like in the description and in the claims are used to distinguish similar elements and not necessarily for describing a sequence, neither over time, nor spatially, nor in ranking, or in any other way. It is to be understood that the terms used in this way are suitable under interchangeable conditions and that the embodiments of the invention described herein are capable of operating in a different order than described or depicted herein.
    In addition, the terms above, below and the like in the description and claims are used for description purposes and not necessarily to describe relative positions. It is to be understood that the terms used in this way are suitable under interchangeable conditions and that the embodiments of the invention described herein are capable of operating in a different order than described or depicted herein.
    It is to be noted that the term "comprises", as used in the claims, is not to be interpreted as being limited to the means described thereafter; this term does not exclude other elements or steps. It can therefore be interpreted as specifying the presence of the listed features, values, steps or components referred to, but does not exclude the presence or addition of one or more other features, values, steps or components, or groups thereof. Thus, the scope of the expression "a device comprising means A and B" should not be limited to devices that consist only of components A and B. It means that with regard to the present invention, A and B are the only relevant components of the device.
    Reference throughout this specification to "one embodiment" or "an embodiment" means that a specific feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, occurrence of the expressions "in one embodiment" or "in an embodiment" at various places throughout this specification may not necessarily all refer to the same embodiment, but may do so. Furthermore, the specific features, structures, or characteristics can be combined in any suitable manner, as would be apparent to those skilled in the art based on this disclosure, in one or more embodiments.
    Similarly, it should be appreciated that in the description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together into a single embodiment, figure, or description thereof for the purpose of streamlining disclosure and assisting in understanding one or several of the various inventive aspects. This method of disclosure should not be interpreted in any way as a reflection of an intention that the invention requires more features than explicitly mentioned in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all the features of a single prior disclosed embodiment. Thus, the claims following the detailed description are hereby explicitly included in this detailed description, with each independent claim as a separate embodiment of the present invention.
    Furthermore, while some embodiments described herein include some, but not other, features included in other embodiments, combinations of features of different embodiments are intended to be within the scope of the invention, and constitute different embodiments, as would be understood by those skilled in the art . For example, in the following claims, any of the described embodiments can be used in any combination.
    Numerous specific details are set forth in the description provided here. It is, however, understood that embodiments of the invention can be practiced without these specific details. In other cases, well-known methods, structures and techniques have not been shown in detail to keep this description clear.
    The holder and bottom plate of the present invention are intended for transporting electronic components. As used herein, and unless otherwise stated, an electronic component is a device for influencing electrons and their associated fields. In particular, the holder and base plate of the present invention are intended for transporting electronic components that are sensitive to electrostatic discharges. For example, a blank wafer is not electrostatically sensitive, but a wafer on which a transistor is located is electrostatically sensitive. For example, as previously stated and as shown in Figures 3 to 5 and their accompanying description, the holder and base plate of the present invention are intended for transporting a roll (with electronic components).
    The term "electrostatically sensitive device protecting" or simply "ESD" or "ESD protecting" characterizes an element adapted to protect a device that is sensitive to electrostatic discharges against such discharges. Typically, an "electrostatically sensitive device protective" element (or an ESD element) is made from a material that prevents electrostatic discharges. Where in embodiments of the present invention reference is made to a material that is "electrostatically sensitive device protective", reference is generally made to a material that is conductive (conductivity of 103 µm to 106 µm) or dissipative (resistivity of 106 µm to 1012 µm ). Preferably the material has a resistivity in the range of 105 to 1011 Ω.m. This is advantageous because such so-called "static-dissipative" materials are not too conductive, but will slowly discharge static charges.
    Where in embodiments of the present invention reference is made to "a component holder", reference is made to a piece of hardware that securely fixes the electronic component to the bottom plate. This piece of hardware can, for example, be integrally formed with the bottom plate and form one whole with it. Such a component holder prevents the electronic component from being damaged by swinging back and forth in the holder. The component holder can form part of the bottom plate, i.e. its negative is already present in the mold for the bottom plate. The component holder may be conductive and conductively connected to the bottom plate to prevent static charge build-up on the electronic component.
    Where "a drying agent" is referred to in embodiments of the present invention, then a hygroscopic substance is used to induce or maintain a state of dryness within the container. In embodiments of the present invention, the relative humidity that may be within the container is maintained due to the desiccant being less than 5% In one embodiment of the present invention, a silica gel pouch is used as a desiccant Depending on the needs, no, one or more desiccant compartment (s) may be required.
    Where in embodiments of the present invention reference is made to "a humidity indicator", reference is made to an object (e.g., a map) that indicates the humidity within the container. These cards preferably face a transparent portion of the lid or bottom plate to allow visual inspection even when the container is closed.
    In a first aspect, the present invention relates to a container that is particularly suitable for preventing the electronic components that it may contain from being exposed to ambient humidity outside the container. Embodiments of the present invention can be used to store any type of electronic components and prevent the components from absorbing moisture, which would make the components unsuitable for soldering. In addition, in certain embodiments of the present invention, the presence of a humidity indicator card will allow to check whether the humidity storage conditions were met during the transportation and storage of the electronic components, even before opening the container. In case the humidity conditions were not met during transport and storage, drying of the components again, to remove the excess moisture before soldering, is preferably required. In certain embodiments of the present invention, the ambient humidity conditions are met by creating a vacuum in the container. In certain embodiments of the present invention, the ambient humidity conditions are met by filling the container with an inert gas such as N 2 or Ar. Furthermore, a system may be adapted to automate a process for creating a vacuum or for filling of the container with an inert gas. This process automation is possible since a rigid bottom plate is used which allows the use of automated tools for sealing as well as for making the vacuum. Alternatively, a conduit that forms a fluid connection between the inside of the container and the atmosphere outside, and that allows to connect a vacuum system, can be added to the rigid bottom plate. The end of the said pipe allows this connection to be sealed after use. Additionally, in certain embodiments of the present invention, desiccants are added to the container to fulfill even stricter humidity conditions and / or to extend the storage time of the electronic components. By way of illustration, embodiments of the present invention, without being limited thereto, are composed of various components that will be described in more detail with reference to FIG. 1 and FIG. 2. FIG. 1 shows a schematic drawing of a top view of a possible bottom plate 101 according to an embodiment of the present invention. FIG. 2 shows a schematic drawing of a side view of a holder according to an embodiment of the present invention. In FIG. 2, both a bottom plate 101 and a lid 201 are shown. Both are sealed to each other, preventing gases from outside the container from penetrating into the volume 105 provided for receiving an electronic component. In embodiments of the present invention, fusion techniques, heating techniques, mechanical techniques, use of glue or any other adhesive, or combinations of the aforementioned techniques can be used to seal both together. The volume 105 of the container as well as the neighboring compartments 102 and 103 are filled with an inert gas or are brought under vacuum. Compartments 102 shown in FIG. 1 and FIG. 2 may be present in some embodiments of the present invention. They allow the accommodation of desiccant bags. They are in fluid communication with the volume 105 through direct openings 106 so that water vapor can be transported from the volume 105 to the compartment 102. The number of compartments 102 can be set depending on the humidity requirements. Additional volumes 103 shown in FIG. 1 may be present in some embodiments of the present invention. They are in fluid communication with the volume 105 through direct openings 106 so that water vapor can be transported from the volume 105 to the compartment 103. The volumes 103 allow the accommodation of humidity indicator cards. Depending on the embodiment of the present invention, no, one or more compartments 103 may be provided for humidity indicator cards. It is an advantage of some embodiments of the present invention that these compartments 103 are visible from the outside of the container without having to open the sealed container. This is made possible by providing transparent areas in the lid 201 or in the bottom plate 101 or in both.
    As shown in FIG. 2, in certain embodiments of the present invention, the container is composed of a bottom plate 101 and a lid 201 with an adhesive layer (not shown) between them. The container thus obtained has typical planar resistance values lying between 103 Ω / square and 1012 Ω / square, preferably between 105 and 1011 Ω / square. In certain embodiments of the present invention, a component holder 104 may be provided for securely mounting the electronic component in the holder. The component holder can be made of the same ESD material, or of a different ESD material, than the material of the bottom plate, which makes it possible to discharge all charges built up on the electronic component before the charges on the electronic component are too high. pose a risk for the electronic 1 component.
    In one embodiment, the present invention relates to a holder for protecting the electronic components that it contains from physical damage. Therefore, the container is preferably a non-deformable closed container. The bottom plate 101 can be made of a rigid or non-deformable material (e.g. rigid plastic). In certain embodiments of the present invention, the lid may be made from a strong ESD web 201 or from a non-deformable or rigid lid 201. The lid and bottom plate are sealed together as shown in FIG. 2, which provides a non-deformable holder that protects the electronic components it contains from physical damage. In certain embodiments of the present invention, a component holder 104 may allow the electronic components to be secured to the bottom plate which prevents the contents from swinging back and forth in the holder during transport and causes physical damage to the electronic components.
    FIG. 3, FIG. 4 and FIG. 5 show the bottom plate 101 of a preferred embodiment of the present invention. The bottom plate 101 is made of a hard, optionally transparent, ESD plastic. In certain embodiments of the present invention, ribs 301 are provided in the bottom plate to increase the strength of the bottom plate. In a preferred embodiment of the present invention, as shown in FIG. 3, a component holder 104 is provided which can hold a roll. Depending on the electronic component, in another embodiment of the present invention, a different component holder may be provided. In a preferred embodiment of the present invention, as shown in FIG. 3, two compartments 102 are provided for containing drying agents. These drying agents can be silica gel bags. An aperture 106 between the compartments 102 and the volume 105 of the container allows efficient absorption by the desiccant of moisture contained in the volume 105 of the container.
    In a preferred embodiment of the present invention, the bottom plate may be vacuum sealed by an, preferably at least partially transparent, ESD fleece that fits on the bottom plate shown in FIG. 3, 4 and 5. In certain embodiments of the present invention, the container may be filled with an inert gas.
    权利要求:
    Claims (13)
    [1]
    Conclusions
    A gas-tight container for transporting and / or storing electronic components, the container comprising: - a gas-tight rigid electrostatically sensitive device protective bottom plate (101) comprising a volume for receiving said electronic component, - a gas-tight electrostatically sensitive device protective cover (201) that can be connected in a gas-tight manner to the bottom plate, in which the bottom plate (101) and / or the cover (201) are wholly or partly transparent, and wherein the bottom plate (101) comprises at least one compartment (102) for containing desiccants, and wherein a direct opening (106) is present between the volume (105) and the compartment (102) and wherein the gas-tight container has a moisture vapor permeability of less than 0.01 g / m2 / day and wherein the material used for the base plate (101) and for the lid (201) has a surface resistance of 103 Ω / square to 1012 Ω / square, preferably from 105 to 10 11 Ω / square.
    [2]
    The gas-tight container according to claim 1, wherein said bottom plate comprises a plurality of compartments for containing desiccants and wherein said compartments are symmetrically distributed around the volume for receiving the electronic component.
    [3]
    The gas-tight container according to claim 1 or 2, wherein said bottom plate (101) comprises a component holder (104) for attaching said electronic component to said bottom plate (101).
    [4]
    The gas-tight container according to any of the preceding claims, wherein the bottom plate comprises at least one compartment (103) for containing a humidity indicator.
    [5]
    The gas-tight container of claim 4, wherein the lid (201) is at least partially transparent and wherein the humidity indicator compartment (103) is placed under a transparent portion of the lid (201) when the lid (201) and the bottom plate (101) are gas-tightly connected to each other.
    [6]
    The gas-tight container according to any one of the preceding claims, wherein the bottom plate (101) is made of a rigid, optionally transparent, electrostatically sensitive device protective plastic.
    [7]
    The gas-tight container according to any of the preceding claims, wherein the lid (201) is made of a rigid, optionally transparent, electrostatically sensitive device protective plastic.
    [8]
    The gas-tight container according to any one of the preceding claims, wherein the lid (201) is made of an at least partially transparent electrostatically sensitive device protective film.
    [9]
    The gas-tight container according to any one of the preceding claims, with a puncture resistance higher than 7.7 kg, preferably higher than 9.1 kg, most preferably higher than 13.6 kg.
    [10]
    The gas-tight container according to any one of the preceding claims, wherein the shape of the container is adapted to stack a container on top of another container in such a way that lateral movement of one container relative to the other container is avoided.
    [11]
    The gas-tight container according to any one of the preceding claims, wherein said electronic component is a roll.
    [12]
    A gas-tight rigid electrostatically sensitive device protective bottom plate (101) for a container according to claim 1, wherein the bottom plate comprises a volume (105) for receiving said electronic component, the bottom plate (101) being wholly or partially transparent, the bottom plate (101) comprises at least one compartment (102) for containing drying agents and wherein a direct opening (106) is present between volume (105) and compartment (102) and wherein the material used for the bottom plate (101) surface resistance has from 103 Ω / square to 1012 Ω / square, preferably from 105 to 1011 Ω / square.
    [13]
    Use of a holder according to any of claims 1 to 11, or of a bottom plate according to claim 12 for transporting and / or storing an electronic component.
    类似技术:
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    同族专利:
    公开号 | 公开日
    GB201311002D0|2013-08-07|
    引用文献:
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    法律状态:
    2020-03-27| MM| Lapsed because of non-payment of the annual fee|Effective date: 20190630 |
    优先权:
    申请号 | 申请日 | 专利标题
    GB201311002A|GB201311002D0|2013-06-20|2013-06-20|Rigid ESD packing for electonic components|
    GB13110028|2013-06-20|
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